TY - GEN
T1 - Electro-thermal based junction temperature estimation model and thermal performance analysis for IGBT module
AU - Xin, Xin
AU - Zhang, Chengning
AU - Zhao, Jing
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/10/2
Y1 - 2017/10/2
N2 - This paper presents an electro-thermal based junction temperature (Tj) estimation method of insulated gate bipolar transistor (IGBT) power module. Firstly, the internal structure of IGBT and its transient characteristics are researched, through which the factors affecting the power loss as well as its basic influence rule are analyze and the multivariable loss calculation model is obtained. And then with the coupling of the loss and Foster model, the maximum Tj is obtained. The method is validated against the simulation of both IPOSIM and finite element method, and the comparison of the results shows the differences were less than 4% which illustrates the accuracy of the estimation model. Finally, the correlation of the module's thermal performance with its internal structure is explored in ANSYS for optimization design. This model contributes to the reliability verification and more reasonable thermal design of IGBT module.
AB - This paper presents an electro-thermal based junction temperature (Tj) estimation method of insulated gate bipolar transistor (IGBT) power module. Firstly, the internal structure of IGBT and its transient characteristics are researched, through which the factors affecting the power loss as well as its basic influence rule are analyze and the multivariable loss calculation model is obtained. And then with the coupling of the loss and Foster model, the maximum Tj is obtained. The method is validated against the simulation of both IPOSIM and finite element method, and the comparison of the results shows the differences were less than 4% which illustrates the accuracy of the estimation model. Finally, the correlation of the module's thermal performance with its internal structure is explored in ANSYS for optimization design. This model contributes to the reliability verification and more reasonable thermal design of IGBT module.
KW - Electro-thermal
KW - Finite element method
KW - IGBT
KW - Junction temperature estimation
UR - https://www.scopus.com/pages/publications/85034653695
U2 - 10.1109/ICEMS.2017.8056072
DO - 10.1109/ICEMS.2017.8056072
M3 - Conference contribution
AN - SCOPUS:85034653695
T3 - 2017 20th International Conference on Electrical Machines and Systems, ICEMS 2017
BT - 2017 20th International Conference on Electrical Machines and Systems, ICEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electrical Machines and Systems, ICEMS 2017
Y2 - 11 August 2017 through 14 August 2017
ER -