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Effect of Compaction Processing on Residual Stress in Molded Sulfur-Based Components

  • Lin Wang*
  • , Chunguang Xu
  • , Xiaowei Guo
  • , Zekai Wang
  • *此作品的通讯作者
  • Beijing Institute of Technology
  • Inner Mongolia University of Technology
  • Ltd
  • Chinese Weapons Science Academy Ningbo Branch

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

To address crack initiation and deformation in sulfur-bonded propellant rings caused by concentrated residual stress during compression molding, high-energy ultrasonic vibration was integrated into the compaction process for in-situ stress modulation. Residual stress was non-destructively quantified using the critical refracted longitudinal (LCR) wave time-of-flight method. The effects of molding parameters and ultrasonic excitation on stress distribution and structural integrity were systematically examined across specimens with varying densities. A calibrated stress coefficient of 0.254 was obtained for the batch, with all density groups showing no detectable cracks or porosity, confirming the efficacy of the optimized formulation and processing route. Ultrasonic-assisted molding reduced peak residual stress by 25-40%, while higher-density specimens exhibited more uniform hoop stress distributions with elevated magnitudes. The results reveal a synergistic interaction between material density and process parameters in tailoring the internal stress field, offering mechanistic insights and practical strategies for precision molding sulfur-based energetic composites. The proposed approach provides a viable framework for residual stress management in thermoset polymer systems for defense applications.

源语言英语
主期刊名Proceedings of 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025
编辑Chunguang Xu
出版商Institute of Electrical and Electronics Engineers Inc.
202-206
页数5
ISBN(电子版)9798331503413
DOI
出版状态已出版 - 2025
已对外发布
活动2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025 - Wuhan, 中国
期限: 23 6月 202526 6月 2025

出版系列

姓名Proceedings of 2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025

会议

会议2025 IEEE Far East NDT New Technology and Application Forum, FENDT 2025
国家/地区中国
Wuhan
时期23/06/2526/06/25

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