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Dynamic conducting crack propagation in piezoelectric materials: Mode-II problem

  • PLA University of Science and Technology
  • Tsinghua University
  • China Aerospace Science and Technology Corporation
  • Shijiazhuang Tiedao University
  • Peking University

科研成果: 期刊稿件文章同行评审

摘要

This paper studies the dynamic conducting crack propagation in piezoelectric solids under suddenly in-plane shear loading. Based on the integral transform methods and the Wiener-Hopf technique, the resulting mixed boundary value problem is solved. The analytical solutions of the dynamic stress intensity factor and dynamic electric displacement intensity factor for the Mode II case are derived. Furthermore, the numerical results are presented to illustrate the characteristics of the dynamic crack propagation. It is shown that the universal functions for the dynamic stress and electric displacement intensity factors vanish if the crack propagation speed equals the generalized Rayleigh speed. The results indicate that the defined electro-mechanical coupling coefficient is of great importance to the universal functions and stress intensity factor history.

源语言英语
页(从-至)769-774
页数6
期刊Science China Technological Sciences
58
5
DOI
出版状态已出版 - 1 5月 2015
已对外发布

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