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Diverse ratio of electronic and internal-strain piezoelectricity in half-Heusler semiconductor for the design of multifunctional piezoelectric devices

  • Zun Yi Deng*
  • , Yingrong Wan
  • , Xiaqing Zhang
  • , Xingan Jiang*
  • , Yongheng Li
  • , Qiyi Zhao
  • , Qixiang Yin*
  • , Xueyun Wang
  • , Yuxiang Zhao*
  • *此作品的通讯作者
  • Tianshui Normal University
  • Ningbo University of Technology
  • Zhongguancun Academy
  • Xi'an Institute of Posts and Telecommunications
  • East China Normal University
  • Beijing Institute of Technology

科研成果: 期刊稿件文章同行评审

摘要

Half-Heusler (HH) semiconductors are promising for piezoelectric applications owing to their non-centrosymmetric structures and thermal stability, but the corresponding piezoelectric mechanisms and atomic-scale tunability remain elusive. This work addresses this gap by investigating non-centrosymmetric HH compounds via atomic substitution. Using first-principles calculations and lattice dynamics analysis, we quantify electronic and internal-strain piezoelectric contributions for 47 HH compounds with the F 4 ¯ 3 m space group, which exhibit remarkable diversity in the ratio of electronic and internal-strain piezoelectric contributions. Critically, atom substitution enables a smooth transition between electronic- and ionic-dominated piezoelectricity, a unique advantage over traditional single-mechanism piezoelectric materials. This tunability provides a unified platform, where the ratio of the two piezoelectric components becomes a key design parameter, bridging atomic-scale structure manipulation and macroscale functionality. Moreover, shear strain engineering demonstrates that piezoelectric performance of most HH materials decreases under strain, yet exceptions (e.g., SbVRu) highlight the potential of mode modulation for performance enhancement. This work not only uncovers the physical origin of HH piezoelectricity but also establishes a framework for strain-controlled multifunctional devices.

源语言英语
期刊论文编号042201
期刊Applied Physics Letters
129
4
DOI
出版状态已出版 - 27 7月 2026
已对外发布

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