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Development of Dual-Frequency PMUT Arrays Based on Thin Ceramic PZT for Endoscopic Photoacoustic Imaging

  • Haoran Wang
  • , Hao Yang
  • , Zhenfang Chen
  • , Qincheng Zheng
  • , Huabei Jiang
  • , Philip X.L. Feng
  • , Huikai Xie*
  • *此作品的通讯作者
  • University of Florida
  • University of South Florida
  • MEMS Engineering and Material Inc.
  • Beijing Institute of Technology
  • BIT Chongqing Institute of Microelectronics and Microsystems

科研成果: 期刊稿件文章同行评审

摘要

This paper presents a dual-frequency piezoelectric micromachined ultrasonic transducer (pMUT) array based on thin ceramic PZT for endoscopic photoacoustic imaging (PAI) applications. With a chip size of 7× 7 mm2, the pMUT array consists of 256 elements, half of which have a lower resonant frequency of 1.2 MHz and the other half have a higher resonant frequency of 3.4 MHz. Ceramic PZT, with outstanding piezoelectric coefficients, has been successfully thinned down to a thickness of only 4μ m by using wafer bonding and chemical mechanical polishing (CMP) techniques and employed as the piezoelectric layer of the pMUT elements. The diaphragm diameters of the lower-frequency and higher-frequency elements are 220μ m and 120μ m, respectively. The design methodology, multiphysics modeling, fabrication process, and characterization of the pMUTs are presented in detail. The fabricated pMUT array has been fully characterized via electrical, mechanical, and acoustic measurements. The measured maximum responsivities of the lower-and higher-frequency elements reach 110 nm/V and 30 nm/V at their respective resonances. The measured cross-couplings of the lower-frequency elements and higher-frequency elements are about 9% and 5%, respectively. Furthermore, PAI experiments with pencil leads embedded into an agar phantom have been conducted, which clearly shows the advantages of using dual-frequency pMUT arrays to provide comprehensive photoacoustic images with high spatial resolution and large signal-to-noise ratio simultaneously.

源语言英语
页(从-至)770-782
页数13
期刊Journal of Microelectromechanical Systems
30
5
DOI
出版状态已出版 - 1 10月 2021

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