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Design of thermal expansion measurement system based on virtual instrument

  • Feng Jin*
  • , Tian Li
  • *此作品的通讯作者
  • Beijing Institute of Technology

科研成果: 期刊稿件文章同行评审

摘要

System architecture is presented for an automatic measurement of thermal expansion. The dynamic measurement of the temperature and thermal expansion displacement of the material is carried out through the application of Labview. The expansion and temperature of material is stored and displayed in real-time. Then the thermal expansion coefficient can be obtained. The measurement system composes of SIOS-SP120D laser interferometer, high vacuum furnace, rbh8223h data acquisition card, rbhS104 conditioning board, constant computer power supply. The USB interface is adopted to collect the temperature and displacement data. Experimental results show that the system has high measurement accuracy and good man-machine interface properties.

源语言英语
页(从-至)509-513
页数5
期刊Journal of Beijing Institute of Technology (English Edition)
22
4
出版状态已出版 - 12月 2013

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