摘要
As the delay of interconnects might exceed the delay of the devices in very deep submicron realm, a novel on-chip bus structure model is proposed and designed. Multiple-valued logic (MVL) technique was used for communication between modules. Address-presetting was employed to improve the transmission efficiency. The designed structure was evaluated by ADMS simulation in a 0.18 μm CMOS technology. The results show that, corresponding to address-presetting binary bus, the number of bus is reduced significantly. In other words, with the same number of bus, the data throughput of designed bus using four-valued-logic technique could be increased by two times.
| 源语言 | 英语 |
|---|---|
| 页(从-至) | 1061-1064 |
| 页数 | 4 |
| 期刊 | Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology |
| 卷 | 32 |
| 期 | 10 |
| 出版状态 | 已出版 - 10月 2012 |
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