Design and simulation of a novel flip-chip structure for THz detector package

Engineering

• Simulation Result 100%
• Antenna Performance 100%
• Gaas Substrate 100%
• Thin Films 50%
• Antenna 50%
• Test System 50%
• Excitation Source 50%
• Good Match 50%
• Bonding Structure 50%
• Design Aspect 50%
• Ceramic Layer 50%