Design and fabrication of micro/bio chip for in vitro fabrication of toroidal cellular aggregates

Puwanan Chumtong, Masaru Kojima, Mitsuhiro Horade, Kenichi Ohara, Kazuto Kamiyama, Yasushi Mae, Yoshikatsu Akiyama, Masayuki Yamato, Tatsuo Arai

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

摘要

The unique geometry of toroidal cellular aggregate has caught much attention during last few years due to its variety of applications in tissue engineering. For example, the micro lumen of connected toroidal aggregates enables a communication channel for vascularization within complex cellular constructs. This channel significantly helps preventing the cell death, due to the lack of nutrients. Furthermore, the direct assembly of multiple toroidal aggregates results in the formation of tissue engineered blood vessel, which is highly needed for transplantation in clinical use. In this paper, we design and fabricate a micro/bio chip enabling the fabrication of toroidal cellular aggregates. The chip has a 3×3 array of deformable scaffolds. Each scaffold has a diameter of 500 μm, a depth of 250 μm, a 130 μm-diameter pillar located in the middle, and a 20 μm-thick membrane coated on the top surface. The temporary toroidal scaffold is generated by decompression before cell seeding, and maintained until the cellular structure is strong. The 1.5×105 cells of NIH3T3 were seeded in a chip, and cellular formation of toroidal shape was observed after 3 days. The retrieved aggregates have an outer diameter of about 330 μm, a lumen diameter of about 40 μm, and a thickness of about 100 μm. The cell viability test confirms the healthy condition of the aggregates. Moreover, the noninvasive recovery of the toroidal aggregates provided by the elastic membrane of the scaffolds suggests effectiveness of using this chip in biological applications.

源语言英语
主期刊名2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
出版商IEEE Computer Society
37-42
页数6
ISBN(印刷版)9781479939787
DOI
出版状态已出版 - 2014
已对外发布
活动11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014 - Tianjin, 中国
期限: 3 8月 20146 8月 2014

出版系列

姓名2014 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014

会议

会议11th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2014
国家/地区中国
Tianjin
时期3/08/146/08/14

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