Design and ballistic penetration of "siC/Ti6Al4V/UHMWPE" composite armor

Yongji Gao, Xinya Feng, Jinxu Liu*, Haidong Fu, Shukui Li, Chuan He

*此作品的通讯作者

科研成果: 期刊稿件会议文章同行评审

15 引用 (Scopus)

摘要

The penetration resistance of "SiC/Ti6Al4V/UHMWPE" composite armor, which involves four different constructions at the same area density, has been designed and presented against 12.7 mm armor piercing (AP) projectiles experimentally. Three armor materials, including silicon carbide (SiC), Ti6Al4V, and ultra-high molecular weight polyethylene (UHMWPE) fiber composite, were prepared together with the investigation on their mechanical properties. Subsequently the composite armors were manufactured by adhesive technology. The ballistic test results show that the target of SiC/UHMWPE and Ti6Al4V/UHMWPE exhibits better penetration resistance against 12.7 mm AP. The study on the protective mechanism indicates that the thicker ceramic front layer can prolong the interaction time with the projectile, causing more energy dissipation by blunting, eroding, and breaking the projectile efficiently and then the thicker UHMWPE backing layer can fully utilize the tensile deformation of fibers to absorb the remaining energy of the projectile. The enlarged loading area of UHMWPE backing plate caused by the deviation of projectile and the petalling fracture of Ti6Al4V can help to fully develop the tensile deformation of fibers, resulting in more energy absorption. For the target of SiC/Ti6Al4V/UHMWPE, Ti6Al4V interlayer contributes to enhancing the ballistic penetration resistance of composite armors by supporting the front ceramic layer and enlarging the loading area of UHMWPE backplate. However, the insertion of Ti6Al4V partly reduces the thickness of SiC layer and UHMWPE composite layer at the equal areal density of the system, leading to the poorer ballistic penetration resistance of the target of SiC/Ti6Al4V/UHMWPE than that of SiC/UHMWPE and Ti6Al4V/UHMWPE.

源语言英语
文章编号042043
期刊IOP Conference Series: Materials Science and Engineering
563
4
DOI
出版状态已出版 - 9 8月 2019
活动2019 2nd International Conference on Advanced Electronic Materials, Computers and Materials Engineering, AEMCME 2019 - Changsha, 中国
期限: 19 4月 201921 4月 2019

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