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Deep feature learning to quantitative prediction of software defects

  • Lei Qiao
  • , Guangjie Li*
  • , Daohua Yu
  • , Hui Liu
  • *此作品的通讯作者
  • Beijing Institute of Technology
  • National Innovation Institute of Defense Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

Defect prediction forecasts defect proneness or the number of defects contained in software systems. It is frequently employed to efficiently prioritize and allocate the limited testing resources to the modules that are more likely to be defective during the process of software development and maintenance. Consequently, a number of defect prediction approaches have been proposed. Most of the existing approaches on defect prediction regard defect prediction as a classification problem in which programs are classified as buggy or non-buggy. However, identifying the defect proneness of a given software module is not sufficient in practical software testing. The research on predicting the number of defects is limited and the performances of these approaches are constantly being optimized and improved. Therefore, in this paper, we propose a novel approach that leverages a convolutional neural network to predict the number of defects in software systems automatically. First, we preprocess the PROMISE dataset, which involves performing natural logarithm transformation and data normalization. Second, we feed the preprocessed dataset to a specially designed convolutional neural network-based model to predict the number of defects. Third, we rank the software modules according to the corresponding predicted number of defects in descending order. We also evaluate the proposed approach on a well-known dataset by cross-validation. The evaluation results suggest that the proposed approach is both accurate and robust, and it improves the state of the art. On average, it significantly improves the Kendall correlation coefficient by 16% and the fault-percentile-average by 4%.

源语言英语
主期刊名Proceedings - 2021 IEEE 45th Annual Computers, Software, and Applications Conference, COMPSAC 2021
编辑W. K. Chan, Bill Claycomb, Hiroki Takakura, Ji-Jiang Yang, Yuuichi Teranishi, Dave Towey, Sergio Segura, Hossain Shahriar, Sorel Reisman, Sheikh Iqbal Ahamed
出版商Institute of Electrical and Electronics Engineers Inc.
页1401-1402
页数2
ISBN(电子版)9781665424639
DOI
出版状态已出版 - 7月 2021
已对外发布是
活动45th Annual IEEE Computers, Software, and Applications Conference, COMPSAC 2021 - Virtual, Online, 西班牙
期限: 12 7月 2021 → 16 7月 2021

丛书

姓名Proceedings - 2021 IEEE 45th Annual Computers, Software, and Applications Conference, COMPSAC 2021

会议

会议45th Annual IEEE Computers, Software, and Applications Conference, COMPSAC 2021
国家/地区西班牙
市Virtual, Online
时期12/07/21 → 16/07/21

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