Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si

K. H. Chen; F. Ren; A. Pais; Huikai Xie; B. P. Gila; S. J. Pearton; J. W. Johnson; P. Rajagopal; J. C. Roberts; E. L. Piner; K. J. Linthicum

doi:10.1116/1.3212931

Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si

K. H. Chen^*
, F. Ren
, A. Pais
, Huikai Xie
, B. P. Gila
, S. J. Pearton
, J. W. Johnson
, P. Rajagopal
, J. C. Roberts
, E. L. Piner
, K. J. Linthicum

^*此作品的通讯作者

University of Florida
Nitronex Corporation

科研成果: 期刊稿件 › 文章 › 同行评审

2 引用（Scopus）

摘要

A robust method for creating Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si is reported. The initial 70 μm deep vias with diameters of 50 μm are created by deep Si reactive ion etching, followed by pulsed Cu electroplating and mechanical polishing to planarize the metal. This is an attractive approach for increasing the effective thermal conductivity of the composite substrate for very high power device applications.

源语言	英语
页（从-至）	2166-2169
页数	4
期刊	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
卷	27
期	5
DOI	https://doi.org/10.1116/1.3212931
出版状态	已出版 - 2009
已对外发布	是

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Chen, K. H., Ren, F., Pais, A., Xie, H., Gila, B. P., Pearton, S. J., Johnson, J. W., Rajagopal, P., Roberts, J. C., Piner, E. L., & Linthicum, K. J. (2009). Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 27(5), 2166-2169. https://doi.org/10.1116/1.3212931

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title = "Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si",

abstract = "A robust method for creating Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si is reported. The initial 70 μm deep vias with diameters of 50 μm are created by deep Si reactive ion etching, followed by pulsed Cu electroplating and mechanical polishing to planarize the metal. This is an attractive approach for increasing the effective thermal conductivity of the composite substrate for very high power device applications.",

author = "Chen, \{K. H.\} and F. Ren and A. Pais and Huikai Xie and Gila, \{B. P.\} and Pearton, \{S. J.\} and Johnson, \{J. W.\} and P. Rajagopal and Roberts, \{J. C.\} and Piner, \{E. L.\} and Linthicum, \{K. J.\}",

year = "2009",

doi = "10.1116/1.3212931",

language = "English",

volume = "27",

pages = "2166--2169",

journal = "Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures",

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Chen, KH, Ren, F, Pais, A, Xie, H, Gila, BP, Pearton, SJ, Johnson, JW, Rajagopal, P, Roberts, JC, Piner, EL & Linthicum, KJ 2009, 'Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si', Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 卷 27, 号码 5, 页码 2166-2169. https://doi.org/10.1116/1.3212931

TY - JOUR

T1 - Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si

AU - Chen, K. H.

AU - Ren, F.

AU - Pais, A.

AU - Xie, Huikai

AU - Gila, B. P.

AU - Pearton, S. J.

AU - Johnson, J. W.

AU - Rajagopal, P.

AU - Roberts, J. C.

AU - Piner, E. L.

AU - Linthicum, K. J.

PY - 2009

Y1 - 2009

N2 - A robust method for creating Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si is reported. The initial 70 μm deep vias with diameters of 50 μm are created by deep Si reactive ion etching, followed by pulsed Cu electroplating and mechanical polishing to planarize the metal. This is an attractive approach for increasing the effective thermal conductivity of the composite substrate for very high power device applications.

AB - A robust method for creating Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si is reported. The initial 70 μm deep vias with diameters of 50 μm are created by deep Si reactive ion etching, followed by pulsed Cu electroplating and mechanical polishing to planarize the metal. This is an attractive approach for increasing the effective thermal conductivity of the composite substrate for very high power device applications.

UR - https://www.scopus.com/pages/publications/70349667463

U2 - 10.1116/1.3212931

DO - 10.1116/1.3212931

M3 - Article

AN - SCOPUS:70349667463

SN - 1071-1023

VL - 27

SP - 2166

EP - 2169

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

IS - 5

ER -

Cu-plated through-wafer vias for AlGaN/GaN high electron mobility transistors on Si

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