Creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu soldering joints

Fangjie Cheng; Zhaolong Ma; Ying Wang; Qingbin Zou

doi:10.1109/TCPMT.2014.2363952

Creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu soldering joints

Fangjie Cheng
, Zhaolong Ma
, Ying Wang
, Qingbin Zou

Tianjin University
Tianjin Key Laboratory of Advanced Joining Technology
Imperial College London

科研成果: 期刊稿件 › 文章 › 同行评审

2 引用（Scopus）

摘要

The creep behaviors of as-soldered and aged Sn0.7Cu0.1Co0.05Ni/Cu joints were studied in this paper. The results indicate that the creep behaviors of as-soldered Sn0.7Cu0.1Co0.05Ni/Cu joints are inferior to those of as-soldered Sn0.7Cu/Cu joints under shear stress of 15-22.5 MPa at 293 and 333 K, respectively. However, the creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu joints are superior to those of Sn0.7Cu/Cu joints after aging at 423 K for 24 h. The underlying creep mechanisms of the Sn0.7Cu and Sn0.7Cu0.1Co0.05Ni/Cu solder joints at experimental condition are suggested. Meanwhile, the microstructure analysis indicates that the superior creep properties of aged Sn0.7Cu0.1Co0.05Ni/Cu joints may mainly attribute to the coarsening resistance of interfacial intermetallic compounds during aging.

源语言	英语
期刊论文编号	6949096
页（从-至）	2058-2065
页数	8
期刊	IEEE Transactions on Components, Packaging and Manufacturing Technology
卷	4
期	12
DOI	https://doi.org/10.1109/TCPMT.2014.2363952
出版状态	已出版 - 1 12月 2014
已对外发布	是

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@article{3cc74f2ac94b49a6bc6cdcbd83f902c4,

title = "Creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu soldering joints",

abstract = "The creep behaviors of as-soldered and aged Sn0.7Cu0.1Co0.05Ni/Cu joints were studied in this paper. The results indicate that the creep behaviors of as-soldered Sn0.7Cu0.1Co0.05Ni/Cu joints are inferior to those of as-soldered Sn0.7Cu/Cu joints under shear stress of 15-22.5 MPa at 293 and 333 K, respectively. However, the creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu joints are superior to those of Sn0.7Cu/Cu joints after aging at 423 K for 24 h. The underlying creep mechanisms of the Sn0.7Cu and Sn0.7Cu0.1Co0.05Ni/Cu solder joints at experimental condition are suggested. Meanwhile, the microstructure analysis indicates that the superior creep properties of aged Sn0.7Cu0.1Co0.05Ni/Cu joints may mainly attribute to the coarsening resistance of interfacial intermetallic compounds during aging.",

keywords = "Aging, creep behavior, solder joints.",

author = "Fangjie Cheng and Zhaolong Ma and Ying Wang and Qingbin Zou",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.",

year = "2014",

month = dec,

day = "1",

doi = "10.1109/TCPMT.2014.2363952",

language = "English",

volume = "4",

pages = "2058--2065",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "12",

}

TY - JOUR

T1 - Creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu soldering joints

AU - Cheng, Fangjie

AU - Ma, Zhaolong

AU - Wang, Ying

AU - Zou, Qingbin

PY - 2014/12/1

Y1 - 2014/12/1

N2 - The creep behaviors of as-soldered and aged Sn0.7Cu0.1Co0.05Ni/Cu joints were studied in this paper. The results indicate that the creep behaviors of as-soldered Sn0.7Cu0.1Co0.05Ni/Cu joints are inferior to those of as-soldered Sn0.7Cu/Cu joints under shear stress of 15-22.5 MPa at 293 and 333 K, respectively. However, the creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu joints are superior to those of Sn0.7Cu/Cu joints after aging at 423 K for 24 h. The underlying creep mechanisms of the Sn0.7Cu and Sn0.7Cu0.1Co0.05Ni/Cu solder joints at experimental condition are suggested. Meanwhile, the microstructure analysis indicates that the superior creep properties of aged Sn0.7Cu0.1Co0.05Ni/Cu joints may mainly attribute to the coarsening resistance of interfacial intermetallic compounds during aging.

AB - The creep behaviors of as-soldered and aged Sn0.7Cu0.1Co0.05Ni/Cu joints were studied in this paper. The results indicate that the creep behaviors of as-soldered Sn0.7Cu0.1Co0.05Ni/Cu joints are inferior to those of as-soldered Sn0.7Cu/Cu joints under shear stress of 15-22.5 MPa at 293 and 333 K, respectively. However, the creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu joints are superior to those of Sn0.7Cu/Cu joints after aging at 423 K for 24 h. The underlying creep mechanisms of the Sn0.7Cu and Sn0.7Cu0.1Co0.05Ni/Cu solder joints at experimental condition are suggested. Meanwhile, the microstructure analysis indicates that the superior creep properties of aged Sn0.7Cu0.1Co0.05Ni/Cu joints may mainly attribute to the coarsening resistance of interfacial intermetallic compounds during aging.

KW - Aging

KW - creep behavior

KW - solder joints.

UR - https://www.scopus.com/pages/publications/84919635878

U2 - 10.1109/TCPMT.2014.2363952

DO - 10.1109/TCPMT.2014.2363952

M3 - Article

AN - SCOPUS:84919635878

SN - 2156-3950

VL - 4

SP - 2058

EP - 2065

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 12

M1 - 6949096

ER -

Creep behaviors of Sn0.7Cu0.1Co0.05Ni/Cu soldering joints

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