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Boron nitride nanosheets decorated with copper nanoparticles to achieve intrinsic strengthening and balanced tensile properties in titanium matrix composites

  • Numan Mahmood
  • , Jiaqi Zhang
  • , Hongmei Zhang*
  • , Xingwang Cheng
  • , Xiaonan Mu*
  • , Ni Xiong
  • , Subhan Mahmood
  • *此作品的通讯作者
  • Beijing Institute of Technology
  • Sichuan University

科研成果: 期刊稿件文章同行评审

摘要

Boron nitride nanosheets (BNNSs) have been widely used to improve the mechanical properties of metal matrix composites (MMCs). However, their high chemical reactivity with titanium (Ti) during high-temperature processing often leads to severe interfacial reactions, which compromises the effective reinforcement efficiency of BNNSs in Ti matrices. In this study, BNNSs coated with copper (Cu) nanoparticles reinforcement (Cu@BNNSs) were designed as an interfacial regulation strategy via electroless plating method. The Cu@BNNSs were incorporated into the Ti matrix and processed using the field-assisted sintering technique (FAST) and subsequent hot rolling (HR). The Cu coating acted as a sacrificial layer that effectively minimized interfacial reaction between BNNSs and Ti, preserving the structural integrity of BNNSs within the matrix. Microstructural analysis revealed a distinct crystallographic orientation relationship: Ti2Cu [3‾32]//α-Ti [011‾0], indicating a well-defined interface that reduced lattice strain and improved adhesion between the BNNSs and the Ti matrix. Tensile tests demonstrated a significant strength enhancement with balanced ductility, reaching up to 773 MPa when the composite contained only 0.05 wt% BNNSs, representing an increase of 47.5% compared to pure Ti. The superior mechanical properties of the Cu@BNNSs/Ti composite are mostly attributed to the high-efficiency load transfer capability of BNNSs, in-situ formed TiBp and Ti2Cu compounds. This study highlights the potential of metal-modified BNNSs reinforcements for designing high-performance Ti-based composites.

源语言英语
文章编号150390
期刊Materials Science and Engineering: A
967
DOI
出版状态已出版 - 8月 2026

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