Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

Leilei Hao; Dongping Chen; Xujia Hou; He Yang; Aiguo Pi

doi:10.1016/j.mtcomm.2026.115175

Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

Leilei Hao
, Dongping Chen^*
, Xujia Hou
, He Yang
, Aiguo Pi^*

^*此作品的通讯作者

Beijing Institute of Technology
China Academy of Engineering Physics

科研成果: 期刊稿件 › 快报 › 同行评审

源语言	英语
文章编号	115175
期刊	Materials Today Communications
卷	54
DOI	https://doi.org/10.1016/j.mtcomm.2026.115175
出版状态	已出版 - 6月 2026
已对外发布	是

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10.1016/j.mtcomm.2026.115175

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title = "Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)",

author = "Leilei Hao and Dongping Chen and Xujia Hou and He Yang and Aiguo Pi",

year = "2026",

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journal = "Materials Today Communications",

issn = "2352-4928",

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Author Reply to “Comment on “Inhibitory effect of low-angle grain boundaries on the creep behavior of gradient nano-grained Cu: A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963). / Hao, Leilei; Chen, Dongping; Hou, Xujia 等.
在: Materials Today Communications, 卷 54, 115175, 06.2026.

科研成果: 期刊稿件 › 快报 › 同行评审

TY - JOUR

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T2 - A molecular dynamics study” by L. Hao et al.” (DOI: 10.1016/j.mtcomm.2024.110963)

AU - Hao, Leilei

AU - Chen, Dongping

AU - Hou, Xujia

AU - Yang, He

AU - Pi, Aiguo

PY - 2026/6

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