@inproceedings{39f62f9bbaee4ef0bfe22684be7e4294,
title = "Analysis on the reference ground in LTCC multilayer packaging",
abstract = "Via array-combining reference and grid structure are often applied in LTCC multilayer package as reference ground. The slot on the border of the finite grounding plane will lead to electromagnetic energy leakage and unwanted resonance. Meanwhile the gird structure will deteriorate the performance on the top layer. This paper provides detailed model, analysis and Electromagnetic Field simulations on the important parameters of the reference ground. Experimental result is also introduced to verify the conclusions. Finally, the design rules are proposed for the design of reference ground.",
keywords = "grid structure, reference ground, slot, via array",
author = "Sha Huan and Dezhao Kong and Jianming Zhou",
year = "2011",
doi = "10.1109/MAPE.2011.6156286",
language = "English",
isbn = "9781424482665",
series = "Proceedings - 2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011",
pages = "228--231",
booktitle = "Proceedings - 2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011",
note = "2011 4th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2011 ; Conference date: 01-11-2011 Through 03-11-2011",
}