Advanced Electronic Packaging Technology: From Hard to Soft

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@article{5540204894d746399b49e0c5ea645ef5,

title = "Advanced Electronic Packaging Technology: From Hard to Soft",

author = "Yue Gu and Yongjun Huo",

year = "2023",

month = mar,

doi = "10.3390/ma16062346",

language = "English",

volume = "16",

journal = "Materials",

issn = "1996-1944",

publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",

number = "6",

}