@inproceedings{53414ba1b0a149c49d4fd88db69e5a29,
title = "A Photothermal Transducer Based on 3D Thermal Management",
abstract = "A photothermal transducer based on three-dimensional (3D) thermal management was proposed. Utilizing the 3D microstructures fabricated on the transducer, the heat diffusion rate on in-plane and out-of-plane direction could be modulated and the thermal properties of the photothermal transducer could be greatly improved. The measured results were in good agreement with the simulation results. Compared to the 2D photothermal transducer, the proposed 3D photothermal transducer with isolation trenches exhibited superior advantages in thermal crosstalk and temperature contrast ratio. The proposed transducer had potential to achieve high temperature contrast, fast time response and ultralarge array scale.",
keywords = "3D microstructure, Photothermal transducer, thermal crosstalk, thermal management",
author = "Jinying Zhang and Defang Li and Zhuo Li and Xin Wang and Suhui Yang",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 ; Conference date: 20-06-2021 Through 25-06-2021",
year = "2021",
month = jun,
day = "20",
doi = "10.1109/Transducers50396.2021.9495754",
language = "English",
series = "21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "601--604",
booktitle = "21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021",
address = "United States",
}