@inproceedings{7c04d9471cb447a8aee844b54b5c1350,
title = "A MEMS Spiral Power Inductor with A Magnetic Core for DC-DC Converters",
abstract = "This paper reports a novel wafer-level fabrication process of a spiral power inductor for DC-DC converters. The inductor features 250 μm-thick copper windings to meet the needs of power devices. The inductor is fabricated with the silicon substrate removed for high Q and wrapped with magnetic materials to achieve high inductance. By using an electroless nickel immersion gold plating process, the inductor terminals are seamlessly connected with copper core solder balls, facilitating the convenience of flip-chip assembly. With a form factor of only 2.5 {\texttimes} 2.5 {\texttimes} 0.65 mm3, the fabricated power inductor achieves a measured inductance of 200 nH at 1 MHz and a Q factor of 17.8 at 81 MHz.",
keywords = "DC-DC Converters, High Q Factor, Magnetic Materials, Power Inductor",
author = "Chongshu Shan and Zilin Li and Hengzhang Yang and Yangyang Yan and Bingyin Kang and Huikai Xie",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 19th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2024 ; Conference date: 02-05-2024 Through 05-05-2024",
year = "2024",
doi = "10.1109/NEMS60219.2024.10639834",
language = "English",
series = "2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 IEEE 19th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2024",
address = "United States",
}