TY - GEN
T1 - A Coriolis Force Compensated Micro Thermal Convective Accelerometer with Low Crossing Effect
AU - Wang, Xiaoyi
AU - Zhao, Xu
AU - Luo, Huahuang
AU - Xu, Wei
AU - Lee, Yi Kuen
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - For the first time, we designed and fabricated a Coriolis-force compensated micro thermal convective accelerometer (CMTCA), which could reduce the Cross-axis sensitivity of a double-aixs MTCA within 2% from 15%. In this design, a couple of compensation detectors are implemented for each of the master detectors. The master detectors are used for acceleration input detecting. By means of this novel structure, the angular input signal could be monitored, which could be used to compensate the cross-axis signal by means of the signal processing circuit simultaneously. This novel design is quite meaningful for improving the accuracy of MTCA and decoupling the signal between acceleration and gyroscope.
AB - For the first time, we designed and fabricated a Coriolis-force compensated micro thermal convective accelerometer (CMTCA), which could reduce the Cross-axis sensitivity of a double-aixs MTCA within 2% from 15%. In this design, a couple of compensation detectors are implemented for each of the master detectors. The master detectors are used for acceleration input detecting. By means of this novel structure, the angular input signal could be monitored, which could be used to compensate the cross-axis signal by means of the signal processing circuit simultaneously. This novel design is quite meaningful for improving the accuracy of MTCA and decoupling the signal between acceleration and gyroscope.
KW - Coriolis Force Compensation
KW - Coupling Effect
KW - Micro Thermal Convective Accelerometer
UR - https://www.scopus.com/pages/publications/85083194884
U2 - 10.1109/MEMS46641.2020.9056163
DO - 10.1109/MEMS46641.2020.9056163
M3 - Conference contribution
AN - SCOPUS:85083194884
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 255
EP - 258
BT - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Y2 - 18 January 2020 through 22 January 2020
ER -