A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography

L. Wu*, S. R. Samuelson, J. Sun, W. Lau, S. Choe, B. S. Sorg, K. Jia, H. Xie

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

8 引用 (Scopus)

摘要

This paper reports a miniature optical coherence tomography (OCT) probe and high-resolution 3D OCT imaging results obtained with this probe. The probe is only 2.8-mm in diameter, enabled by a unique high-fill-factor electrothermal MEMS mirror with hidden actuators and a novel wire-bonding-free (WBF) packaging technique. The MEMS mirror has a large mirror aperture of 1 mm with a chip size of only 1.55×1.7×0.5 mm3. The fabricated device achieves large 2-D scan optical angles up to 46° at only 4.8 V. High-resolution 3D OCT imaging results are also demonstrated using this assembled probe.

源语言英语
主期刊名2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
33-36
页数4
DOI
出版状态已出版 - 2011
已对外发布
活动24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, 墨西哥
期限: 23 1月 201127 1月 2011

出版系列

姓名Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

会议

会议24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
国家/地区墨西哥
Cancun
时期23/01/1127/01/11

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