每年的科研成果
每年的科研成果
指纹图谱
深入探索 Ziyue Zhang 活跃其中的研究主题。这些主题标签来自该研究者的学术成果，它们共同构成了一个独特的学术指纹.
- 1 相似学者
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A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management
Wang, H., Ding, Y., Zhang, Z., Zhang, J., Zhang, A., Pei, X. & Chen, Z., 6月 2026, 在: Micromachines. 17, 6, 724.科研成果: 期刊稿件 › 文章 › 同行评审
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Double-Sided Fabrication of TSV Interposer With Parylene-Based Damascene RDLs Achieved by Selective Electroless Plating
Su, Y., Ding, Y., Zhang, Z., Wang, H., Hao, Y., Yan, Y., Xie, H. & Chen, Z., 2026, 在: IEEE Electron Device Letters. 47, 1, 页码 140-143 4 页码科研成果: 期刊稿件 › 文章 › 同行评审
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Fabrication and Characterizations of High-Aspect-Ratio TSVs With Low Parasitic Parameters for High-Density 3-D Integration
Chen, X., Chen, Z., Zhang, Z., Zhang, J., Su, Y. & Ding, Y., 8月 2026, 在: IEEE Transactions on Electron Devices. 73, 8, 页码 4817-4823 7 页码科研成果: 期刊稿件 › 文章 › 同行评审
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Modeling and Optimization of TSV Cu Electroplating Process for Void-Free Filling
Cai, Y., Chen, Z., Zhang, Z., Su, Y., Li, X. & Ding, Y., 2026, 2026 27th International Conference on Electronic Packaging Technology, ICEPT 2026. 2026 编辑 Institute of Electrical and Electronics Engineers Inc.科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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Study of Keep-Out Zone (KOZ) Characteristics for Parylene-Liner TSVs Fabricated by Double-Sided Processes
Zhang, J., Ding, Y., Zhang, Z., Su, Y., Hao, Y. & Chen, Z., 2026, 2026 27th International Conference on Electronic Packaging Technology, ICEPT 2026. 2026 编辑 Institute of Electrical and Electronics Engineers Inc.科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审