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孙 鹏
前沿交叉科学研究院
h-index
493
引用
10
H-指数
根据储存在 Pure 的刊物以及来自 Scopus 的引用文献数量计算
2020
2025
每年的科研成果
概览
指纹图谱
合作网络
科研成果
(20)
相似学者
(2)
指纹图谱
深入其中 Peng Sun 为活跃的研究主题。这些主题标签来自此人的成果。它们共同形成唯一的指纹。
分类
加权
按字母排序
Material Science
Aerogels
6%
Biocompatibility
11%
Bond Strength (Materials)
61%
Bovine Serum Albumin
10%
Cell Membrane
6%
Chirality
20%
Coating Process
6%
Copolymer
20%
Copolymerization
10%
Crystalline Material
40%
Electrostatic Interaction
20%
Epoxy
10%
Feedstock
25%
Film
36%
Film Growth
5%
Glass Fiber
10%
Glass Transition Temperature
6%
Hot Melt Adhesives
20%
Hydrogel
40%
Hydrogen Bonding
10%
Iron Ion
5%
Iron Oxide
10%
Luminescence
36%
Mechanical Strength
20%
Nanoparticle
50%
Nuclear Magnetic Resonance
20%
Perovskite Solar Cell
20%
Photoluminescence
20%
Photopolymerization
20%
Physical Property
20%
Polymer
20%
Polymer Matrix
20%
Polymerization
73%
Polymorphism
20%
Polypropylene
5%
Protein
20%
Solvent Resistance
20%
Structure (Composition)
10%
Surface Active Agent
6%
Theoretical Calculation
20%
Thermal Stability
20%
Thermoset Plastics
10%
Three Dimensional Printing
6%
Tumor
13%
Volume Fraction
20%
Chemistry
Aggregation-Induced Emission
20%
Alkyne
20%
Ambient Reaction Temperature
100%
Carbonyl Group
5%
Chirality
8%
Crystallinity
9%
Doping Material
15%
Emission Wavelength
6%
Enzyme-Linked Immunosorbent Assay
20%
Exciton
8%
Isatin
20%
Microwave Irradiation
5%
Molecular Mass
5%
Monomer
5%
Nanoparticle
10%
Occurrence in Nature
5%
Oleanolic Acid
20%
Oxindole
20%
Photoluminescence
5%
Poly(vinylidene)
20%
Polymerization
5%
Pyrrole
20%
Red
24%
Structure
19%
Tartaric Acid
8%
Thermal Stability
5%
Ursolic Acid
20%
Vinylidene Fluoride
20%
Engineering
Bonding Property
10%
Bonding Strength
20%
Conductive
20%
Emission Wavelength
6%
Fine Chemical
10%
Glass Fibre Reinforced Epoxy
10%
Hot-Melt Adhesive
20%
Interfacial Interaction
10%
Microelectronics
10%
Microwave Heating
10%
Nanoparticle
20%
Penetrability
10%
Renewable Feedstock
6%
Reusability
15%
Room Temperature
40%
Side Chain
5%
Strong Adhesion
20%
