W-band monopole antenna-in-system design approached on molding compound material

Cheng Jin; Rui Li; Xiaowu Zhang; Arokiaswami Alphones

doi:10.1109/APCAP.2012.6333139

W-band monopole antenna-in-system design approached on molding compound material

Cheng Jin^*, Rui Li, Xiaowu Zhang, Arokiaswami Alphones

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.

Original language	English
Title of host publication	2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings
Pages	59-60
Number of pages	2
DOIs	https://doi.org/10.1109/APCAP.2012.6333139
Publication status	Published - 2012
Externally published	Yes
Event	2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Singapore, Singapore Duration: 27 Aug 2012 → 29 Aug 2012

Publication series

Name	2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings

Conference

Conference	2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012
Country/Territory	Singapore
City	Singapore
Period	27/08/12 → 29/08/12

Keywords

Molding Compound Material
W-band
antenna-in-system
monopole antenna

Access to Document

10.1109/APCAP.2012.6333139

Cite this

Jin, C., Li, R., Zhang, X., & Alphones, A. (2012). W-band monopole antenna-in-system design approached on molding compound material. In 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings (pp. 59-60). Article 6333139 (2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings). https://doi.org/10.1109/APCAP.2012.6333139

@inproceedings{5404897ed7f74456b9fa439ff415367c,

title = "W-band monopole antenna-in-system design approached on molding compound material",

abstract = "A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.",

keywords = "Molding Compound Material, W-band, antenna-in-system, monopole antenna",

author = "Cheng Jin and Rui Li and Xiaowu Zhang and Arokiaswami Alphones",

year = "2012",

doi = "10.1109/APCAP.2012.6333139",

language = "English",

isbn = "9781467306676",

series = "2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings",

pages = "59--60",

booktitle = "2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings",

note = "2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 ; Conference date: 27-08-2012 Through 29-08-2012",

}

Jin, C, Li, R, Zhang, X & Alphones, A 2012, W-band monopole antenna-in-system design approached on molding compound material. in 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings., 6333139, 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings, pp. 59-60, 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012, Singapore, Singapore, 27/08/12. https://doi.org/10.1109/APCAP.2012.6333139

W-band monopole antenna-in-system design approached on molding compound material. / Jin, Cheng; Li, Rui; Zhang, Xiaowu et al.
2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings. 2012. p. 59-60 6333139 (2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - W-band monopole antenna-in-system design approached on molding compound material

AU - Jin, Cheng

AU - Li, Rui

AU - Zhang, Xiaowu

AU - Alphones, Arokiaswami

PY - 2012

Y1 - 2012

N2 - A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.

AB - A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.

KW - Molding Compound Material

KW - W-band

KW - antenna-in-system

KW - monopole antenna

UR - http://www.scopus.com/inward/record.url?scp=84869446416&partnerID=8YFLogxK

U2 - 10.1109/APCAP.2012.6333139

DO - 10.1109/APCAP.2012.6333139

M3 - Conference contribution

AN - SCOPUS:84869446416

SN - 9781467306676

T3 - 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings

SP - 59

EP - 60

BT - 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings

T2 - 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012

Y2 - 27 August 2012 through 29 August 2012

ER -

W-band monopole antenna-in-system design approached on molding compound material

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