Thermal shock modeling of Ultra-High Temperature Ceramics under active cooling

Weiguo Li, Fan Yang, Daining Fang*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)

Abstract

Thermal shock resistance is one of the most important parameters in Ultra-High Temperature Ceramics (UHTCs) since it determines their performance in various applications. In this paper, due to the fact that the material parameters of UHTCs are very sensitive to the variations of temperature, the temperature-dependent thermal shock resistance parameters of UHTCS are studied using an analytical model. The effects of target temperature on the thermal shock behavior of UHTCs thermal protection system (TPS) under active cooling are examined. The calculated results show that thermal shock behavior of the UHTCs' TPS is strongly affected by the target temperature.

Original languageEnglish
Pages (from-to)2373-2378
Number of pages6
JournalComputers and Mathematics with Applications
Volume58
Issue number11-12
DOIs
Publication statusPublished - Dec 2009
Externally publishedYes

Keywords

  • Active cooling
  • Target temperature
  • Thermal protection system
  • Thermal shock resistance
  • Ultra-High Temperature Ceramics

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