@inproceedings{33535a8247dd4d7c97b942fc286dcd24,
title = "Thermal Microscopic Imaging based on Diffusion Models for Super-resolution Inspection",
abstract = "Existing infrared micro-thermal imaging often faces low resolution and contrast issue, which hinder its applications in high-precision integrated circuit inspection. Based on the advanced super-resolution techniques, high-resolution infrared images can be reconstructed from low-resolution measurements. Recently, diffusion models have shown strong capacity in the image reconstruction tasks. However, due to the low signal-to-noise ratio and inferior contrast, directly applying the traditional diffusion models to the infrared image is hardly to obtain high-quality super-resolution results. In this work, we first design a degradation model for real infrared imaging systems, and then we design an infrared super-resolution diffusion model based on ResShift, which introduces uncertainty into the u-net to enhance the robustness of the model and the reconstruction quality of the infrared images. The proposed method is validated based on a set of numerical experiments.",
keywords = "Diffusion Model, Infrared Imaging, Integrated Circuit Inspection, Super Resolution, Thermal Microscopic Imaging",
author = "Xin Sun and Jun Ke and Xu Ma",
note = "Publisher Copyright: {\textcopyright} 2024 SPIE.; 8th International Workshop on Advanced Patterning Solutions, IWAPS 2024 ; Conference date: 15-10-2024 Through 16-10-2024",
year = "2024",
doi = "10.1117/12.3053147",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Yayi Wei and Tianchun Ye",
booktitle = "Eighth International Workshop on Advanced Patterning Solutions, IWAPS 2024",
address = "United States",
}