Thermal analysis of a micro shear-stress sensor

Ying Tao Ding; Hai Bo Lu; Shun An Zhong; Jun Tang Xie

Thermal analysis of a micro shear-stress sensor

Ying Tao Ding^*, Hai Bo Lu, Shun An Zhong, Jun Tang Xie

^*Corresponding author for this work

School of Integrated Circuits and Electronics

Beijing Institute of Technology

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Thermal analysis based on numerical simulation is carried out to study the performance of sensors with various micro-structures, thermal element temperature, and gas working media. The simulation results showed that the heat loss on the substrate is the smallest for the sensor with vacuum cavity. The numerical results also indicate that high thermal element temperature and high gas conduction coefficient are beneficial to the sensitivity.

Original language	English
Pages (from-to)	427-430
Number of pages	4
Journal	Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology
Volume	29
Issue number	5
Publication status	Published - May 2009

Keywords

Micro-electro-mechanical-systems (MEMS)
Sensitivity
Shear-stress sensor
Thermal element

Cite this

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title = "Thermal analysis of a micro shear-stress sensor",

abstract = "Thermal analysis based on numerical simulation is carried out to study the performance of sensors with various micro-structures, thermal element temperature, and gas working media. The simulation results showed that the heat loss on the substrate is the smallest for the sensor with vacuum cavity. The numerical results also indicate that high thermal element temperature and high gas conduction coefficient are beneficial to the sensitivity.",

keywords = "Micro-electro-mechanical-systems (MEMS), Sensitivity, Shear-stress sensor, Thermal element",

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AU - Ding, Ying Tao

AU - Lu, Hai Bo

AU - Zhong, Shun An

AU - Xie, Jun Tang

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N2 - Thermal analysis based on numerical simulation is carried out to study the performance of sensors with various micro-structures, thermal element temperature, and gas working media. The simulation results showed that the heat loss on the substrate is the smallest for the sensor with vacuum cavity. The numerical results also indicate that high thermal element temperature and high gas conduction coefficient are beneficial to the sensitivity.

AB - Thermal analysis based on numerical simulation is carried out to study the performance of sensors with various micro-structures, thermal element temperature, and gas working media. The simulation results showed that the heat loss on the substrate is the smallest for the sensor with vacuum cavity. The numerical results also indicate that high thermal element temperature and high gas conduction coefficient are beneficial to the sensitivity.

KW - Micro-electro-mechanical-systems (MEMS)

KW - Sensitivity

KW - Shear-stress sensor

KW - Thermal element

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M3 - Article

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SN - 1001-0645

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JO - Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology

JF - Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology

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ER -

Thermal analysis of a micro shear-stress sensor

Abstract

Keywords

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