Theoretical Calculation And Simulation Of Surface-Modified Scalable Silicon Heat Sink For Electronics Cooling

Yichi Zhang; Shinichi Saito; Yoshishige Tsuchiya; Yeliang Wang

doi:10.2298/TSCI2106181Z

Theoretical Calculation And Simulation Of Surface-Modified Scalable Silicon Heat Sink For Electronics Cooling

Yichi Zhang^*
, Shinichi Saito
, Yoshishige Tsuchiya
, Yeliang Wang

^*Corresponding author for this work

School of Integrated Circuits and Electronics

Beijing Institute of Technology
University of Southampton

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estima-tion of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resis-tance of 6.84 °C per Watt is achieved for the structure with a larger fin area (13.1 cm²) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.

Original language	English
Pages (from-to)	4181-4187
Number of pages	7
Journal	Thermal Science
Volume	26
Issue number	6 Part A
DOIs	https://doi.org/10.2298/TSCI2106181Z
Publication status	Published - 2021

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

silicon heat sinks
surface modification
thermal resistance

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10.2298/TSCI2106181Z

Cite this

@article{62dd881a143e4c7cae6b7ffdb1e00fe4,

title = "Theoretical Calculation And Simulation Of Surface-Modified Scalable Silicon Heat Sink For Electronics Cooling",

abstract = "A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estima-tion of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resis-tance of 6.84 °C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.",

keywords = "silicon heat sinks, surface modification, thermal resistance",

author = "Yichi Zhang and Shinichi Saito and Yoshishige Tsuchiya and Yeliang Wang",

note = "Publisher Copyright: {\textcopyright} 2021. Society of Thermal Engineers of Serbia",

year = "2021",

doi = "10.2298/TSCI2106181Z",

language = "English",

volume = "26",

pages = "4181--4187",

journal = "Thermal Science",

issn = "0354-9836",

publisher = "Serbian Society of Heat Transfer Engineers",

number = "6 Part A",

}

TY - JOUR

T1 - Theoretical Calculation And Simulation Of Surface-Modified Scalable Silicon Heat Sink For Electronics Cooling

AU - Zhang, Yichi

AU - Saito, Shinichi

AU - Tsuchiya, Yoshishige

AU - Wang, Yeliang

PY - 2021

Y1 - 2021

N2 - A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estima-tion of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resis-tance of 6.84 °C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.

AB - A surface-modified scalable heat sink that can be fabricated by applying silicon microfabrication technology has been proposed in this paper. Theoretical estima-tion of the heat sink thermal resistance is based on the heat sink with overall size of 1 cm × 1 cm × 1 cm, and four kinds of structure with various total number of grooves on the surface of fins have been investigated. Finite element analysis has been conducted by using COMSOL Multiphysics where fluid dynamics and heat transfer are taken into account. As a result, the lowest heat sinks thermal resis-tance of 6.84 °C per Watt is achieved for the structure with a larger fin area (13.1 cm2) and a higher inlet air flow rate (4 m/s), suggesting an optimum fin area depending on the air flow rate.

KW - silicon heat sinks

KW - surface modification

KW - thermal resistance

UR - https://www.scopus.com/pages/publications/85117402098

U2 - 10.2298/TSCI2106181Z

DO - 10.2298/TSCI2106181Z

M3 - Article

AN - SCOPUS:85117402098

SN - 0354-9836

VL - 26

SP - 4181

EP - 4187

JO - Thermal Science

JF - Thermal Science

IS - 6 Part A

ER -

Theoretical Calculation And Simulation Of Surface-Modified Scalable Silicon Heat Sink For Electronics Cooling

Abstract

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Keywords

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