The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping

Yue Feng; Zilong Zhou; Wenlong Wang; Zehong Rao; Yanhui Han

doi:10.1109/NEMS51815.2021.9451427

The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping

Yue Feng
, Zilong Zhou
, Wenlong Wang
, Zehong Rao
, Yanhui Han

School of Mechatronical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Citations (Scopus)

Abstract

A highly accurate three-dimensional (3D) capacitance analytical model of parallel plates is important for the optimal design of electrostatic MEMS devices. However, due to constraints of fabrication processes, two parallel conducting plates are ineluctably tilted at an angle. Basically, finite element analysis (FEA) seems the preferred access to evaluate fringing effects across the non-parallel plates, while the analytical solution is not available. In this work, we present an analytical model for the 3D capacitance of a non-parallel-plate structure using the conformal mapping method. Taking the fringing effect into account, the proposed model shows a high accuracy of 95%, compared with other models.

Original language	English
Title of host publication	Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1264-1267
Number of pages	4
ISBN (Electronic)	9781665419413
DOIs	https://doi.org/10.1109/NEMS51815.2021.9451427
Publication status	Published - 25 Apr 2021
Event	16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021 - Xiamen, China Duration: 25 Apr 2021 → 29 Apr 2021

Publication series

Name	Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021

Conference

Conference	16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
Country/Territory	China
City	Xiamen
Period	25/04/21 → 29/04/21

Keywords

3D capacitance model
Fringing effect
conformal mapping
non-parallel-plate capacitor

Access to Document

10.1109/NEMS51815.2021.9451427

Cite this

Feng, Y., Zhou, Z., Wang, W., Rao, Z., & Han, Y. (2021). The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping. In Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021 (pp. 1264-1267). Article 9451427 (Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS51815.2021.9451427

Feng, Yue ; Zhou, Zilong ; Wang, Wenlong et al. / The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping. Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 1264-1267 (Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021).

@inproceedings{723c35d399424a66847f8e81726f6c6f,

title = "The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping",

abstract = "A highly accurate three-dimensional (3D) capacitance analytical model of parallel plates is important for the optimal design of electrostatic MEMS devices. However, due to constraints of fabrication processes, two parallel conducting plates are ineluctably tilted at an angle. Basically, finite element analysis (FEA) seems the preferred access to evaluate fringing effects across the non-parallel plates, while the analytical solution is not available. In this work, we present an analytical model for the 3D capacitance of a non-parallel-plate structure using the conformal mapping method. Taking the fringing effect into account, the proposed model shows a high accuracy of 95\%, compared with other models.",

keywords = "3D capacitance model, Fringing effect, conformal mapping, non-parallel-plate capacitor",

author = "Yue Feng and Zilong Zhou and Wenlong Wang and Zehong Rao and Yanhui Han",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021 ; Conference date: 25-04-2021 Through 29-04-2021",

year = "2021",

month = apr,

day = "25",

doi = "10.1109/NEMS51815.2021.9451427",

language = "English",

series = "Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1264--1267",

booktitle = "Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021",

address = "United States",

}

Feng, Y, Zhou, Z, Wang, W, Rao, Z & Han, Y 2021, The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping. in Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021., 9451427, Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021, Institute of Electrical and Electronics Engineers Inc., pp. 1264-1267, 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021, Xiamen, China, 25/04/21. https://doi.org/10.1109/NEMS51815.2021.9451427

The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping. / Feng, Yue; Zhou, Zilong; Wang, Wenlong et al.
Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 1264-1267 9451427 (Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping

AU - Feng, Yue

AU - Zhou, Zilong

AU - Wang, Wenlong

AU - Rao, Zehong

AU - Han, Yanhui

PY - 2021/4/25

Y1 - 2021/4/25

N2 - A highly accurate three-dimensional (3D) capacitance analytical model of parallel plates is important for the optimal design of electrostatic MEMS devices. However, due to constraints of fabrication processes, two parallel conducting plates are ineluctably tilted at an angle. Basically, finite element analysis (FEA) seems the preferred access to evaluate fringing effects across the non-parallel plates, while the analytical solution is not available. In this work, we present an analytical model for the 3D capacitance of a non-parallel-plate structure using the conformal mapping method. Taking the fringing effect into account, the proposed model shows a high accuracy of 95%, compared with other models.

AB - A highly accurate three-dimensional (3D) capacitance analytical model of parallel plates is important for the optimal design of electrostatic MEMS devices. However, due to constraints of fabrication processes, two parallel conducting plates are ineluctably tilted at an angle. Basically, finite element analysis (FEA) seems the preferred access to evaluate fringing effects across the non-parallel plates, while the analytical solution is not available. In this work, we present an analytical model for the 3D capacitance of a non-parallel-plate structure using the conformal mapping method. Taking the fringing effect into account, the proposed model shows a high accuracy of 95%, compared with other models.

KW - 3D capacitance model

KW - Fringing effect

KW - conformal mapping

KW - non-parallel-plate capacitor

UR - https://www.scopus.com/pages/publications/85113312652

U2 - 10.1109/NEMS51815.2021.9451427

DO - 10.1109/NEMS51815.2021.9451427

M3 - Conference contribution

AN - SCOPUS:85113312652

T3 - Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021

SP - 1264

EP - 1267

BT - Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021

Y2 - 25 April 2021 through 29 April 2021

ER -

Feng Y, Zhou Z, Wang W, Rao Z, Han Y. The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping. In Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 1264-1267. 9451427. (Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021). doi: 10.1109/NEMS51815.2021.9451427

The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping

Abstract

Publication series

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this