Temperature-aware task scheduling heuristics on Network-on-Chips

  • Shan Cao
  • , Zoran Salcic
  • , Yingtao Ding*
  • , Zhaolin Li
  • , Shaojun Wei
  • , Xianli Zhao
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Citations (Scopus)

Abstract

Chip temperature becomes a critical design issue with technology scaling to nanometer-scale, especially for NoC systems with large number of cores and shrunken core size. To reduce peak temperature and balance spatial temperature distribution on NoC-based multi-cores chips, this paper proposes a temperature-aware task scheduling approach. The thermal profiles of tasks are first extracted by accurate temperature model. Then run-time task mapping heuristic is proposed considering transient core temperatures, thermal dissipation from adjacent cores, communication overheads and the thermal influence of physical position on chip. Voltage-frequency is also scaled down when timing constraint is met to reduce power consumption and core temperature. Experimental results show that the significant reduction of peak temperature and the temperature variance compared with the current approaches is achieved.

Original languageEnglish
Title of host publicationISCAS 2016 - IEEE International Symposium on Circuits and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2603-2606
Number of pages4
ISBN (Electronic)9781479953400
DOIs
Publication statusPublished - 29 Jul 2016
Event2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada
Duration: 22 May 201625 May 2016

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
Volume2016-July
ISSN (Print)0271-4310

Conference

Conference2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
Country/TerritoryCanada
CityMontreal
Period22/05/1625/05/16

Keywords

  • Network-on-Chips
  • Scheduling
  • Temperature

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