TY - GEN
T1 - Surface micromachined cantilever arrays for infrared imaging
AU - Yi, Yuliang
AU - Yu, Xiaomei
AU - Liu, Ming
AU - Liu, Xiaohua
AU - Zhao, Yuejin
PY - 2008
Y1 - 2008
N2 - This paper presents the design, fabrication and performance of a bimaterial microcantilever focal plane array (FPA) of 256x256 pixels for uncooled infrared (IR) imaging. The microcantilevers made of silicon nitride (SiNx) and gold (Au) convert incident IR energy to a distribution of deflection angles among the FPA pixels according to the IR source, which is read out by an optical method. The thermo-mechanical sensitivity of the cantilever pixel was measured to be 147nm/K. The noise equivalent temperature difference (NETD) of the FPA was theoretically estimated to be 130mK and the response time was calculated to be 12ms. Thermal image of the heated brand iron were captured by the fabricated FPA. The most valuable feature of the implemented FPA is their scalability to high resolution formats without progressively growing fabrication complexity and cost.
AB - This paper presents the design, fabrication and performance of a bimaterial microcantilever focal plane array (FPA) of 256x256 pixels for uncooled infrared (IR) imaging. The microcantilevers made of silicon nitride (SiNx) and gold (Au) convert incident IR energy to a distribution of deflection angles among the FPA pixels according to the IR source, which is read out by an optical method. The thermo-mechanical sensitivity of the cantilever pixel was measured to be 147nm/K. The noise equivalent temperature difference (NETD) of the FPA was theoretically estimated to be 130mK and the response time was calculated to be 12ms. Thermal image of the heated brand iron were captured by the fabricated FPA. The most valuable feature of the implemented FPA is their scalability to high resolution formats without progressively growing fabrication complexity and cost.
UR - http://www.scopus.com/inward/record.url?scp=60649112009&partnerID=8YFLogxK
U2 - 10.1109/ICSICT.2008.4735078
DO - 10.1109/ICSICT.2008.4735078
M3 - Conference contribution
AN - SCOPUS:60649112009
SN - 9781424421855
T3 - International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
SP - 2496
EP - 2499
BT - ICSICT 2008 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology Proceedings
T2 - 2008 9th International Conference on Solid-State and Integrated-Circuit Technology, ICSICT 2008
Y2 - 20 October 2008 through 23 October 2008
ER -