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Study on stealth bulletproof integrated composite material based on multi-layer resistance film

  • 33th Institute of China Electronics Technology Group Corporation
  • Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

A integrated design method based on resistance film and lightweight bulletproof materials is adopted. For this design, the lightweight bulletproof material is also used as the dielectric substrate of composite material structure. And six layers of resistance film is inserted in the seven layers of bulletproof material. The conductivity of each layer of resistance film is 55 S/m. Bulletproof material uses PE laminated. The measured results show that the integrated composite material has an absorption rate of more than 90% in the 6.88GHz30.58GHz, which also can effectively protect the 53-type 7.62mm ordinary steel core bullet. The thickness of stealth bulletproof integrated composite material is 17.5mm, which achieved the light and thin character. The stealth bulletproof integrated composite material is designed through the combination of the absorbing structure and the bulletproof material. The implement method of stealth bulletproof material is no longer a simple functional overlay, but an integrated fusion design of structure and function. It solves the shortage of traditional stealth bulletproof materials. This design method has great significance for improving the combat capability of new functional vehicles.

Original languageEnglish
Title of host publication6th IEEE Global Electromagnetic Compatibility Conference, GEMCCon 2020 - Proceeding
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728184630
DOIs
Publication statusPublished - 20 Oct 2020
Event6th IEEE Global Electromagnetic Compatibility Conference, GEMCCon 2020 - Xi'an, China
Duration: 20 Oct 2020 → 23 Oct 2020

Publication series

Name6th IEEE Global Electromagnetic Compatibility Conference, GEMCCon 2020 - Proceeding

Conference

Conference6th IEEE Global Electromagnetic Compatibility Conference, GEMCCon 2020
Country/TerritoryChina
CityXi'an
Period20/10/20 → 23/10/20

Keywords

  • Absorbing media
  • Bulletproof
  • Conducting films
  • Functional integration
  • Land vehicles

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