TY - GEN
T1 - Study on low-cost QFN packages for high-frequency applications
AU - Zheng, Boyu
AU - Cubillo, Joseph Romen
AU - Katti, Guruprasad
AU - Jin, Cheng
AU - Rajoo, Ranjan
AU - Chan, Kai Chong
PY - 2012
Y1 - 2012
N2 - Quad flat no-lead (QFN) packages have found wide applications in RF and high-speed digital systems. The purpose of this paper is to study high-frequency performance of conventional low-cost QFN packages, and the impact of various parameters. Physical insight of the bond wires and leadframe are presented through full-wave simulation study. Critical parameters are identified and their effects are evaluated at frequencies up to 20 GHz.
AB - Quad flat no-lead (QFN) packages have found wide applications in RF and high-speed digital systems. The purpose of this paper is to study high-frequency performance of conventional low-cost QFN packages, and the impact of various parameters. Physical insight of the bond wires and leadframe are presented through full-wave simulation study. Critical parameters are identified and their effects are evaluated at frequencies up to 20 GHz.
UR - http://www.scopus.com/inward/record.url?scp=84879741207&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2012.6507116
DO - 10.1109/EPTC.2012.6507116
M3 - Conference contribution
AN - SCOPUS:84879741207
SN - 9781467345514
T3 - Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
SP - 401
EP - 406
BT - Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
T2 - 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Y2 - 5 December 2012 through 7 December 2012
ER -