Study on low-cost QFN packages for high-frequency applications

Boyu Zheng, Joseph Romen Cubillo, Guruprasad Katti, Cheng Jin, Ranjan Rajoo, Kai Chong Chan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

Quad flat no-lead (QFN) packages have found wide applications in RF and high-speed digital systems. The purpose of this paper is to study high-frequency performance of conventional low-cost QFN packages, and the impact of various parameters. Physical insight of the bond wires and leadframe are presented through full-wave simulation study. Critical parameters are identified and their effects are evaluated at frequencies up to 20 GHz.

Original languageEnglish
Title of host publicationProceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Pages401-406
Number of pages6
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012 - Singapore, Singapore
Duration: 5 Dec 20127 Dec 2012

Publication series

NameProceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012

Conference

Conference2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Country/TerritorySingapore
CitySingapore
Period5/12/127/12/12

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