Study on curing kinetics and behaviours of PGN adhesives

Tengbo Li; Xiaomeng Li; Shanjun Ding; Yunjun Luo

doi:10.1039/d1ra04942a

Study on curing kinetics and behaviours of PGN adhesives

Tengbo Li
, Xiaomeng Li
, Shanjun Ding
, Yunjun Luo

School of Material Science and Engineering

Beijing Institute of Technology

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.

Original language	English
Pages (from-to)	34836-34841
Number of pages	6
Journal	RSC Advances
Volume	11
Issue number	55
DOIs	https://doi.org/10.1039/d1ra04942a
Publication status	Published - 27 Oct 2021

Access to Document

10.1039/d1ra04942a

Cite this

@article{cf0f3b6b9833495b87a25abec8470251,

title = "Study on curing kinetics and behaviours of PGN adhesives",

abstract = "The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.",

author = "Tengbo Li and Xiaomeng Li and Shanjun Ding and Yunjun Luo",

note = "Publisher Copyright: {\textcopyright} The Royal Society of Chemistry.",

year = "2021",

month = oct,

day = "27",

doi = "10.1039/d1ra04942a",

language = "English",

volume = "11",

pages = "34836--34841",

journal = "RSC Advances",

issn = "2046-2069",

publisher = "Royal Society of Chemistry",

number = "55",

}

TY - JOUR

T1 - Study on curing kinetics and behaviours of PGN adhesives

AU - Li, Tengbo

AU - Li, Xiaomeng

AU - Ding, Shanjun

AU - Luo, Yunjun

PY - 2021/10/27

Y1 - 2021/10/27

N2 - The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.

AB - The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.

UR - https://www.scopus.com/pages/publications/85120088804

U2 - 10.1039/d1ra04942a

DO - 10.1039/d1ra04942a

M3 - Article

AN - SCOPUS:85120088804

SN - 2046-2069

VL - 11

SP - 34836

EP - 34841

JO - RSC Advances

JF - RSC Advances

IS - 55

ER -

Study on curing kinetics and behaviours of PGN adhesives

Abstract

Access to Document

Other files and links

Fingerprint

Cite this