Study on Ag-CuO sealing materials for planer SOFC

Ag-CuO sealing material was used to realize the sealing between the SUS430 interconnect and the NiO-YSZ anode in air. Leakage rate were tested, and SEM and EPMA tests were conducted to determine its hermeticity, compatability and thermal cycling stability. Results indicated that Ag-CuO sealing material could realize the seals between the interconnect and the anode effectively, and when the Cu content was 6mol%, the simulating leakage was smallest, and lower than 0.001mL/(min·cm).After ten times thermal cycling, the leakage rate kept stable. EPMA analyses proved that no element diffusion occured at the interconnect/Ag-CuO interface.