TY - GEN
T1 - Study of rough surface to decrease reverberation noise in ultrasonic imaging
AU - Zhang, Jinying
AU - Han, Gang
AU - Chen, Shuming
AU - Qian, Yue
AU - Xu, Weijiang
AU - Carlier, Julien
AU - Nongaillard, Bertrand
PY - 2012
Y1 - 2012
N2 - Rough back surface is investigated to decrease the reverberation noise in ultrasonic imaging. Silicon crystal is selected as the backing substrate of the ultrasonic transducer because rough structure is convenient to be fabricated on silicon substrate using microfabrication technologies. Different dimensions of rough boundaries are designed and simulated to scatter the undesired waves based on finite element method modeling. Transient analysis indicates that a rough surface whose dimension (including depth and width) is around 1.0 λ should be considered to scatter a majority of incident waves.
AB - Rough back surface is investigated to decrease the reverberation noise in ultrasonic imaging. Silicon crystal is selected as the backing substrate of the ultrasonic transducer because rough structure is convenient to be fabricated on silicon substrate using microfabrication technologies. Different dimensions of rough boundaries are designed and simulated to scatter the undesired waves based on finite element method modeling. Transient analysis indicates that a rough surface whose dimension (including depth and width) is around 1.0 λ should be considered to scatter a majority of incident waves.
UR - https://www.scopus.com/pages/publications/84868274378
U2 - 10.1109/NEWCAS.2012.6329068
DO - 10.1109/NEWCAS.2012.6329068
M3 - Conference contribution
AN - SCOPUS:84868274378
SN - 9781467308595
T3 - 2012 IEEE 10th International New Circuits and Systems Conference, NEWCAS 2012
SP - 509
EP - 512
BT - 2012 IEEE 10th International New Circuits and Systems Conference, NEWCAS 2012
T2 - 2012 IEEE 10th International New Circuits and Systems Conference, NEWCAS 2012
Y2 - 17 June 2012 through 20 June 2012
ER -