Strong and efficient bismuth telluride-based thermoelectrics for Peltier microcoolers

  • Hua Lu Zhuang
  • , Bowen Cai
  • , Yu Pan
  • , Bin Su
  • , Yilin Jiang
  • , Jun Pei
  • , Fengming Liu
  • , Haihua Hu
  • , Jincheng Yu
  • , Jing Wei Li
  • , Zhengqin Wang
  • , Zhanran Han
  • , Hezhang Li
  • , Chao Wang
  • , Jing Feng Li*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Thermoelectric Peltier coolers (PCs) are being increasingly used as temperature stabilizers for optoelectronic devices. Increasing integration drives PC miniaturization, requiring thermoelectric materials with good strength. We demonstrate a simultaneous gain of thermoelectric and mechanical performance in (Bi, Sb)2Te3, and successfully fabricate micro PCs (2 × 2 mm2 cross-section) that show excellent maximum cooling temperature difference of 89.3 K with a hot-side temperature of 348 K. A multi-step process involving annealing, hot-forging and composition design, is developed to modify the atomic defects and nano- and microstructures. The peak ZT is improved to ∼1.50 at 348 K, and the flexural and compressive strengths are significantly enhanced to ∼140 MPa and ∼224 MPa, respectively. These achievements hold great potential for advancing solid-state refrigeration technology in small spaces.

Original languageEnglish
Article numbernwae329
JournalNational Science Review
Volume11
Issue number10
DOIs
Publication statusPublished - 1 Oct 2024
Externally publishedYes

Keywords

  • Peltier cooler
  • bismuth telluride
  • microdevice
  • powder metallurgy
  • precision processing
  • thermoelectric

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