Abstract
Thermoelectric Peltier coolers (PCs) are being increasingly used as temperature stabilizers for optoelectronic devices. Increasing integration drives PC miniaturization, requiring thermoelectric materials with good strength. We demonstrate a simultaneous gain of thermoelectric and mechanical performance in (Bi, Sb)2Te3, and successfully fabricate micro PCs (2 × 2 mm2 cross-section) that show excellent maximum cooling temperature difference of 89.3 K with a hot-side temperature of 348 K. A multi-step process involving annealing, hot-forging and composition design, is developed to modify the atomic defects and nano- and microstructures. The peak ZT is improved to ∼1.50 at 348 K, and the flexural and compressive strengths are significantly enhanced to ∼140 MPa and ∼224 MPa, respectively. These achievements hold great potential for advancing solid-state refrigeration technology in small spaces.
| Original language | English |
|---|---|
| Article number | nwae329 |
| Journal | National Science Review |
| Volume | 11 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 1 Oct 2024 |
| Externally published | Yes |
Keywords
- Peltier cooler
- bismuth telluride
- microdevice
- powder metallurgy
- precision processing
- thermoelectric
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