Simulations and Experiments on the Fabrication of Silicon Tip

Mingliang Wang, Daoheng Sun*, Yanhua Wang

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

Abstract

Simulations and experiments on three kinds of Si tip fabrication techniques had been done, which are Anisotropic Dry Etching (ADE), Anisotropic Wet Etching (AWE) and AWE combining with bonding. The simulation results showed that the parameters applied in the ADE and AWE should be controlled much more precisely than AWE combining with bonding to get expected tips. The experiments prove that the parameters of fabricating silicon tip by ADE and AWE have little tolerance. The conclusions on AWE combining with bonding drew from simulations are verified in the detail experiments. From the simulations and experiments, excellent reliability and controllability are witnessed in AWE combining with bonding and a tip with top diameter within 23.44nm had been achieved.

Original languageEnglish
Pages (from-to)35-41
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5342
DOIs
Publication statusPublished - 2004
Externally publishedYes
EventMicromachining and Microfabrication Process Technology IX - San Jose, CA., United States
Duration: 27 Jan 200429 Jan 2004

Keywords

  • Anisotropic dry etching
  • Anisotropic wet etching
  • Bonding
  • Silicon tip

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