TY - GEN
T1 - Shock-Resistant Design for MEMS Optical Switch Based on Displacement-Limited Structure
AU - Xie, Jin
AU - He, Tao
AU - Lian, Zheng
AU - Zhang, Xiao
AU - Xiong, Zhuang
AU - Cao, Jun
AU - Zhang, Hao
AU - Zeng, Chao
AU - Zhao, Yizhuang
AU - Dai, Jun
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Microelectromechanical systems (MEMS) optical switch, notable for its compact dimension and ease of integration, has been widely applied in military and aerospace fields. However, when facing the high value impact overloads and shocking environment, the structural failure may occur in the MEMS optical switch, causing the functional damage in the whole system. This paper focuses on the methodology of shock-resistant design for multi-body coupling MEMS optical switch basing on displacement-limited dynamics and novel fabrication process. A back-support structure and glass cap work together to protect the movable microstructure against out-of-plane displacement. A double-sided deep reactive ion etching process was used to fabricate the MEMS optical switch on a silicon-on-insulator substrate. A model was constructed based on displacement-limited dynamics to explain the protection mechanism under high overloads. Experimental results indicated that the MEMS optical switch survived overloads as high as 25,000 g with an impulse of 105 μs, which far surpass the shock resistances of existing designs. This study is expected to promote the application of functional MEMS optical switch in high shocking environments.
AB - Microelectromechanical systems (MEMS) optical switch, notable for its compact dimension and ease of integration, has been widely applied in military and aerospace fields. However, when facing the high value impact overloads and shocking environment, the structural failure may occur in the MEMS optical switch, causing the functional damage in the whole system. This paper focuses on the methodology of shock-resistant design for multi-body coupling MEMS optical switch basing on displacement-limited dynamics and novel fabrication process. A back-support structure and glass cap work together to protect the movable microstructure against out-of-plane displacement. A double-sided deep reactive ion etching process was used to fabricate the MEMS optical switch on a silicon-on-insulator substrate. A model was constructed based on displacement-limited dynamics to explain the protection mechanism under high overloads. Experimental results indicated that the MEMS optical switch survived overloads as high as 25,000 g with an impulse of 105 μs, which far surpass the shock resistances of existing designs. This study is expected to promote the application of functional MEMS optical switch in high shocking environments.
KW - displacement-limited structures
KW - light weight design
KW - microelectromechanical system
KW - optical switch
KW - shock-resistant
UR - http://www.scopus.com/inward/record.url?scp=105001672965&partnerID=8YFLogxK
U2 - 10.1109/ICSMD64214.2024.10920628
DO - 10.1109/ICSMD64214.2024.10920628
M3 - Conference contribution
AN - SCOPUS:105001672965
T3 - ICSMD 2024 - 5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence
BT - ICSMD 2024 - 5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th International Conference on Sensing, Measurement and Data Analytics in the Era of Artificial Intelligence, ICSMD 2024
Y2 - 31 October 2024 through 3 November 2024
ER -