TY - JOUR
T1 - Self-healing and shape-memory epoxy thermosets based on dynamic diselenide bonds
AU - Liu, Xiaohong
AU - Song, Xuan
AU - Chen, Bifang
AU - Liu, Jiaming
AU - Feng, Zhiqiang
AU - Zhang, Wenchao
AU - Zeng, Juanjuan
AU - Liang, Liyan
N1 - Publisher Copyright:
© 2021 Elsevier B.V.
PY - 2022/1
Y1 - 2022/1
N2 - The fabrication and development of excellent thermoset polymers with self-healing and shape memory properties is highly desirable. Herein, a novel high-strength epoxy resin (EP-SeSe) with diselenide bonds was rationally designed for rapid repair materials in building constructions and electrical packaging. The resultant resins exhibit excellent shape memory performance and self-healing performance due to the dynamic diselenide bonds (Se–Se), while maintaining a high mechanical strength (tensile strength = 105 MPa and E = 2.0GPa), and exceptional thermal stability. It is especially noteworthy that the diselenide bonds of the bis(4-aminophenyl) diselenide (BAPDSe) allow EP-SeSe to exchange molecular chains in a dynamic manner, facilitating transport of chain segments while the ortho-phenyl groups prevent the side effects of weak bonds on mechanical properties. Furthermore, when the temperature exceeds Tg, EP-SeSe displays fast stress relaxation, self-healing, remodeling, and weldability due to the [2 + 1] radical-mediated mechanism of the diselenide bonds. We envision that this study provides a facile method for constructing robust multifunctional epoxy resins, which have great potential applications for self-healing and shape-memory epoxy resins.
AB - The fabrication and development of excellent thermoset polymers with self-healing and shape memory properties is highly desirable. Herein, a novel high-strength epoxy resin (EP-SeSe) with diselenide bonds was rationally designed for rapid repair materials in building constructions and electrical packaging. The resultant resins exhibit excellent shape memory performance and self-healing performance due to the dynamic diselenide bonds (Se–Se), while maintaining a high mechanical strength (tensile strength = 105 MPa and E = 2.0GPa), and exceptional thermal stability. It is especially noteworthy that the diselenide bonds of the bis(4-aminophenyl) diselenide (BAPDSe) allow EP-SeSe to exchange molecular chains in a dynamic manner, facilitating transport of chain segments while the ortho-phenyl groups prevent the side effects of weak bonds on mechanical properties. Furthermore, when the temperature exceeds Tg, EP-SeSe displays fast stress relaxation, self-healing, remodeling, and weldability due to the [2 + 1] radical-mediated mechanism of the diselenide bonds. We envision that this study provides a facile method for constructing robust multifunctional epoxy resins, which have great potential applications for self-healing and shape-memory epoxy resins.
KW - Diselenide bond
KW - Epoxy resins
KW - Self-healing
KW - Shape-memory performance
UR - http://www.scopus.com/inward/record.url?scp=85120161778&partnerID=8YFLogxK
U2 - 10.1016/j.reactfunctpolym.2021.105121
DO - 10.1016/j.reactfunctpolym.2021.105121
M3 - Article
AN - SCOPUS:85120161778
SN - 1381-5148
VL - 170
JO - Reactive and Functional Polymers
JF - Reactive and Functional Polymers
M1 - 105121
ER -