Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener

Peng Wang; Yang Ju; Mingji Chen

doi:10.1016/j.apsusc.2015.05.072

Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener

Peng Wang
, Yang Ju^*
, Mingji Chen

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

At millimeter dimensions or less, the conventional bonding technology tends to suffer from severe performance and reliability degradation. Moreover, the high heating temperature is usually needed. Here, we report a room-temperature electrical surface fastener based on copper/polystyrene core/shell nanowire (NW) arrays. Uniquely, this electrical surface fastener exhibits high macroscopic adhesion strength (∼44.42 N/cm ² ) and low electrical resistance (∼0.75 × 10 ^-2 Ω cm ² ). Furthermore, it was found that the adhesion strength of this surface fastener can be mediated by the shell thickness and the molecular weight of polystyrene. Finally, the contact mechanics theory was used to explain the adhesion mechanism.

Original language	English
Pages (from-to)	774-779
Number of pages	6
Journal	Applied Surface Science
Volume	349
DOIs	https://doi.org/10.1016/j.apsusc.2015.05.072
Publication status	Published - 15 Sept 2015
Externally published	Yes

Keywords

Core/shell nanowire
Electrical bonding
Electronic packaging
Room-temperature

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10.1016/j.apsusc.2015.05.072

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title = "Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener",

abstract = " At millimeter dimensions or less, the conventional bonding technology tends to suffer from severe performance and reliability degradation. Moreover, the high heating temperature is usually needed. Here, we report a room-temperature electrical surface fastener based on copper/polystyrene core/shell nanowire (NW) arrays. Uniquely, this electrical surface fastener exhibits high macroscopic adhesion strength (∼44.42 N/cm 2 ) and low electrical resistance (∼0.75 × 10 -2 Ω cm 2 ). Furthermore, it was found that the adhesion strength of this surface fastener can be mediated by the shell thickness and the molecular weight of polystyrene. Finally, the contact mechanics theory was used to explain the adhesion mechanism.",

keywords = "Core/shell nanowire, Electrical bonding, Electronic packaging, Room-temperature",

author = "Peng Wang and Yang Ju and Mingji Chen",

year = "2015",

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doi = "10.1016/j.apsusc.2015.05.072",

language = "English",

volume = "349",

pages = "774--779",

journal = "Applied Surface Science",

issn = "0169-4332",

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T1 - Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener

AU - Wang, Peng

AU - Ju, Yang

AU - Chen, Mingji

PY - 2015/9/15

Y1 - 2015/9/15

N2 - At millimeter dimensions or less, the conventional bonding technology tends to suffer from severe performance and reliability degradation. Moreover, the high heating temperature is usually needed. Here, we report a room-temperature electrical surface fastener based on copper/polystyrene core/shell nanowire (NW) arrays. Uniquely, this electrical surface fastener exhibits high macroscopic adhesion strength (∼44.42 N/cm 2 ) and low electrical resistance (∼0.75 × 10 -2 Ω cm 2 ). Furthermore, it was found that the adhesion strength of this surface fastener can be mediated by the shell thickness and the molecular weight of polystyrene. Finally, the contact mechanics theory was used to explain the adhesion mechanism.

AB - At millimeter dimensions or less, the conventional bonding technology tends to suffer from severe performance and reliability degradation. Moreover, the high heating temperature is usually needed. Here, we report a room-temperature electrical surface fastener based on copper/polystyrene core/shell nanowire (NW) arrays. Uniquely, this electrical surface fastener exhibits high macroscopic adhesion strength (∼44.42 N/cm 2 ) and low electrical resistance (∼0.75 × 10 -2 Ω cm 2 ). Furthermore, it was found that the adhesion strength of this surface fastener can be mediated by the shell thickness and the molecular weight of polystyrene. Finally, the contact mechanics theory was used to explain the adhesion mechanism.

KW - Core/shell nanowire

KW - Electrical bonding

KW - Electronic packaging

KW - Room-temperature

UR - https://www.scopus.com/pages/publications/84937695275

U2 - 10.1016/j.apsusc.2015.05.072

DO - 10.1016/j.apsusc.2015.05.072

M3 - Article

AN - SCOPUS:84937695275

SN - 0169-4332

VL - 349

SP - 774

EP - 779

JO - Applied Surface Science

JF - Applied Surface Science

ER -

Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener

Abstract

Keywords

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