Research on Mechanical Simulation Experiment and Assembly Technology for Large-size Circlip for Hole

Bolun Jing*, Cong Li, Yiguan Shi, Chaojiang Li*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Owing to space constraints and the lack of a dedicated gripper for compressing large-sized circlips for hole during automatic assembly of shell components, a study was conducted on the assembly technology for such circlips. Initially, the shrinkage effect of a circlip under two compression methods was analyzed using ABAQUS software. The simulation showed that for a circlip with a nominal diameter of 150mm, thickness of 2mm, and made of 65Mn material, applying a total compression of 10mm resulted in virtually identical shrinkage between symmetric and asymmetric compression methods along the line connecting the two small holes. However, in the direction perpendicular to the connecting line, symmetrical compression led to shrinkage values of 1.854mm and 1.746mm for each small hole, while asymmetrical compression caused one small hole to expand by 2.367mm, producing the opposite effect. Thus, it can be inferred that symmetrical compression yields more favorable shrinkage effects for circlips. Based on this conclusion, structural design modifications were made to develop a gripper specifically for large-sized circlips, including key components like the support structure, transmission structure, and clamping compression structure.

Original languageEnglish
Title of host publicationProceedings - 2023 2nd International Conference on Advanced Sensing, Intelligent Manufacturing, ASIM 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages123-128
Number of pages6
ISBN (Electronic)9798350385571
DOIs
Publication statusPublished - 2023
Event2nd International Conference on Advanced Sensing, Intelligent Manufacturing, ASIM 2023 - Changsha, China
Duration: 23 Dec 202324 Dec 2023

Publication series

NameProceedings - 2023 2nd International Conference on Advanced Sensing, Intelligent Manufacturing, ASIM 2023

Conference

Conference2nd International Conference on Advanced Sensing, Intelligent Manufacturing, ASIM 2023
Country/TerritoryChina
CityChangsha
Period23/12/2324/12/23

Keywords

  • assembly technology
  • circlip for hole
  • gripper
  • mechanical simulation

Fingerprint

Dive into the research topics of 'Research on Mechanical Simulation Experiment and Assembly Technology for Large-size Circlip for Hole'. Together they form a unique fingerprint.

Cite this