Abstract
The availability of the domestic positive resist BP212 and optical exposure equipment in fabricating the electrode of MEMS device using lift-off process is discussed. The results show that the available photoresist section with undercut profile and metal line with μm-level line uniformity are obtained by the adopted method, which simplifies lift-off process, reduces the cost and improves the metal electrode fabrication.
| Original language | English |
|---|---|
| Pages (from-to) | 53-56 |
| Number of pages | 4 |
| Journal | Weixi Jiagong Jishu/Microfabrication Technology |
| Issue number | 3 |
| Publication status | Published - Sept 2005 |
| Externally published | Yes |
Keywords
- Electrode
- Lift-off
- Photoresist