Abstract
Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review of several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.
| Original language | English |
|---|---|
| Pages (from-to) | 570-583 |
| Number of pages | 14 |
| Journal | Acta Mechanica Solida Sinica |
| Volume | 26 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - Dec 2013 |
Keywords
- residual stress mechanical release method hole drilling moiré interferometry holography ESPI digital image correlation