TY - GEN
T1 - Programmable Optoelectronic Assembly of Semiconductor Nanoparticles via Light-Triggered Surface Charge Modulation
AU - Mao, Yanan
AU - Li, Gong
AU - Du, Henan
AU - Wu, Meng
AU - Fu, Rongxin
AU - Xie, Huikai
AU - Zhang, Shuailong
N1 - Publisher Copyright:
© 2026 IEEE.
PY - 2026
Y1 - 2026
N2 - This paper presents an innovative optoelectronic tweezer-based strategy that enables precise patterning of semiconductor nanoparticles through light-triggered modulation of surface charges. This technique enables the dynamic assembly of microscale architectures, characterized by low cost, minimal power consumption, high biocompatibility, and programmable control. It can provide a versatile and efficient platform for designing and fabricating next-generation functional devices. Without the need for physical masks, the semiconductor particle assembly technology can form predefined patterns ranging from micrometers to centimeters on chip surfaces within minutes. This approach demonstrates excellent spatial selectivity, enabling sequential or parallel processing of multiple regions on a single chip while allowing for repeated assembly on the same substrate. These capabilities indicate its significant potential for applications in optoelectronic device manufacturing, microrobotics, and related fields.
AB - This paper presents an innovative optoelectronic tweezer-based strategy that enables precise patterning of semiconductor nanoparticles through light-triggered modulation of surface charges. This technique enables the dynamic assembly of microscale architectures, characterized by low cost, minimal power consumption, high biocompatibility, and programmable control. It can provide a versatile and efficient platform for designing and fabricating next-generation functional devices. Without the need for physical masks, the semiconductor particle assembly technology can form predefined patterns ranging from micrometers to centimeters on chip surfaces within minutes. This approach demonstrates excellent spatial selectivity, enabling sequential or parallel processing of multiple regions on a single chip while allowing for repeated assembly on the same substrate. These capabilities indicate its significant potential for applications in optoelectronic device manufacturing, microrobotics, and related fields.
KW - colloidal assembly
KW - micro- and nanofabrication
KW - optoelectronic tweezers
KW - semiconductor nanoparticles
UR - https://www.scopus.com/pages/publications/105047778916
U2 - 10.1109/NEMS69704.2026.11633552
DO - 10.1109/NEMS69704.2026.11633552
M3 - Conference contribution
AN - SCOPUS:105047778916
T3 - 2026 IEEE 21st International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
SP - 265
EP - 270
BT - 2026 IEEE 21st International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
Y2 - 17 April 2026 through 21 April 2026
ER -