Preparation of copper surfaces with controlled wettability through the molecular self-assembling process

  • Ying Du
  • , Haijie Chen
  • , Zhongjun Cheng
  • , Hua Lai
  • , Naiqing Zhang
  • , Kening Sun*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

We report a novel method for the fabrication of copper surfaces with controlled wettability. Through modification of the nanostructured copper substrates with mixed thiol molecules of HS(CH2)9CH3 and HS(CH2)11OH, surfaces with controlled wettability from superhydrophobicity to superhydrophilicity can be achieved by simply controlling the concentration of HS(CH2)11OH in the modified solution. The controllability of the surfaces wettability can be ascribed to the combined effect of the surface chemistry variation and the hierarchical micro/nanostructures on the substrates. Especially the presence of hierarchical micro/nanostructures, which can provide a better control of the surface wettability between the two extremes: superhydrophobicity and superhydrophilicity.

Original languageEnglish
Pages (from-to)105-109
Number of pages5
JournalKao Teng Hsueh Hsiao Hua Heush Hsueh Pao/ Chemical Journal of Chinese Universities
Volume35
Issue number1
DOIs
Publication statusPublished - Jan 2014
Externally publishedYes

Keywords

  • Copper surface
  • Molecular self-assemble
  • Superhydrophilic surface
  • Superhydrophobic surface
  • Wettability

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