Abstract
The advent of molybdenum disulfide (MoS2) offers hope for transistor continuous scaling. In this study, the back-gate monolayer MoS2 transistors at different channel lengths are prepared, and their electrical properties are tested, respectively. The back-gate MoS2 transistor exhibits a maximum conducting current of 4.59μ A and a switching ratio of 2.3× 105. The ratio of contact resistance to the total resistance is up to 33%, indicating that the contact between MoS2 and the electrode is one of the main factors restricting its performance. Technology Computer-Aided Design (TCAD) simulations are also used to predict the performance of a smaller channel-length MoS2 transistor (Lg =12 nm). We set the MoS2 material parameters and construct a monolayer MoS2 nanosheet FET (NSFET) using TCAD. The simulation result of this structure shows a subthreshold swing (SS) of 68.9 mV/dec, a drain-induced barrier lowering (DIBL) value of 14.98 mV/V and a conduction current of 243.3 μA/μm at the gate voltage of 0.7V. By comparing its performance with the most advanced silicon-based devices, MoS2 exhibits excellent electrostatic properties and holds great potential for replacing silicon as a channel material.
| Original language | English |
|---|---|
| Pages (from-to) | 7081-7086 |
| Number of pages | 6 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 72 |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 2025 |
Keywords
- Bulk and nanosheet transistor
- characteristic test and simulation prediction
- molybdenum disulfide (MoS)
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