Optimized thermo-mechanical behavior of SiCp/Al composites through modified preform preparation process

Silicon-carbide reinforced aluminum matrix (SiCp/Al) composites are considered promising materials for high-performance applications such as automotive, thermal management, and aerospace. This is due to their excellent strength-to-weight ratio and high thermal conductivity. However, fabricating dense, high-volume-fraction composites, particularly above 50 vol% remains challenging, where poor infiltration and high porosity typically degrade performance. This study addresses the gap by developing a modified preform preparation technique for vacuum pressure infiltration by tailoring the binder content and powder packing to achieve highly dense composites. Using this approach, SiCp/Al composites with 10–70 vol% SiCp were successfully fabricated, achieving low porosity (∼ 5.23 %), high compressive strength (815.1 MPa), and moderate thermal conductivity (149.4 W/m.K). The microstructural analysis reveals an atomically bonded, strong semi-coherent SiCp/Al interface with a d-spacing of 0.247 nm for Al and 0.255 nm for SiC. The dislocation strengthening mechanisms synergistically enhanced load transfer efficiency. The proposed method offers a scalable pathway to fabricate high-performing SiCp/Al composites with a balanced combination of thermophysical and mechanical properties for demanding structural and thermal management applications.