Optimization and evaluation of a high-performance liquid metal CPU cooling product

This paper is dedicated to present theoretical optimization and experimental investigations on a practical liquid metal CPU cooling product. On the basis of a former working prototype developed in the lab, a series of critical parameters were identified and the optimization criterion was established. A schematic thermal resistance model revealed that the electromagnetic pump and fin radiator in the heat transport loop were the key components to determining the output of the system level cooling performance. Then all the critical parameters for the electromagnetic pump and fin radiator were investigated and optimized using related theoretical sub-models. With appropriate industrial design, a practical liquid metal CPU cooling product was fabricated and compared to six typical commercial cooling products. The results demonstrated that the liquid metal product could serve as one of the best CPU cooling devices in the market. Though it was inferior to the best heat pipe product with heating power of below 100 W, it, however, exhibited much better performance when the heating was increased to a level of 400 W or higher, thus ensuring a promising prospect for future high-profile CPUs.