TY - JOUR
T1 - Oblique-pulse ion beams achieve cross-scale synchronized correction and ultra-smooth surfaces in ultra-thin SPO optics
AU - Xie, Lingbo
AU - Shi, Feng
AU - Wang, Shanshan
AU - Tian, Ye
AU - Guo, Shuangpeng
N1 - Publisher Copyright:
© 2025
PY - 2026/3/15
Y1 - 2026/3/15
N2 - Achieving sub-arcsecond resolution in next-generation X-ray telescopes like Athena requires ultra-thin Silicon Pore Optics (SPO) mirrors with exceptional surface accuracy (TTV <100 nm) and ultra-smoothness (<0.1 nm roughness). Current fabrication methods fall short: contact polishing deforms thin wafers, while non-contact ion beam figuring (IBF) struggles with selective nanoscale material removal, especially as TTV approaches 100 nm, due to global processing and inability to suppress high-frequency errors. This study proposes an oblique pulsed ion beam (OPIB) process. By precisely controlling the pulsed beam to irradiate only identified surface high-point regions, OPIB achieves highly selective, nanoscale topographic modification. This targeted approach effectively mitigates the additional material removal layers inherent to conventional global scanning methods. Furthermore, leveraging the asymmetric sputtering effect of oblique pulsed beams, the OPIB process efficiently planarizes nanoscale structures. This synergistic action ultimately yielded an atomically ultra-smooth and flat surface, characterized by a TTV of 46.7 nm and an RMS roughness of 0.081 nm. This technology provides a groundbreaking paradigm for cross-scale morphology control in high-precision ultra-thin optical components (X-ray focusing mirrors, EUV lithography masks), offering significant industrial application potential.
AB - Achieving sub-arcsecond resolution in next-generation X-ray telescopes like Athena requires ultra-thin Silicon Pore Optics (SPO) mirrors with exceptional surface accuracy (TTV <100 nm) and ultra-smoothness (<0.1 nm roughness). Current fabrication methods fall short: contact polishing deforms thin wafers, while non-contact ion beam figuring (IBF) struggles with selective nanoscale material removal, especially as TTV approaches 100 nm, due to global processing and inability to suppress high-frequency errors. This study proposes an oblique pulsed ion beam (OPIB) process. By precisely controlling the pulsed beam to irradiate only identified surface high-point regions, OPIB achieves highly selective, nanoscale topographic modification. This targeted approach effectively mitigates the additional material removal layers inherent to conventional global scanning methods. Furthermore, leveraging the asymmetric sputtering effect of oblique pulsed beams, the OPIB process efficiently planarizes nanoscale structures. This synergistic action ultimately yielded an atomically ultra-smooth and flat surface, characterized by a TTV of 46.7 nm and an RMS roughness of 0.081 nm. This technology provides a groundbreaking paradigm for cross-scale morphology control in high-precision ultra-thin optical components (X-ray focusing mirrors, EUV lithography masks), offering significant industrial application potential.
KW - Atomically ultra-smooth
KW - Materials science
KW - Nanotechnology
KW - Pulsed ion beam
KW - Silicon pore optics
UR - https://www.scopus.com/pages/publications/105024672659
U2 - 10.1016/j.apsusc.2025.165555
DO - 10.1016/j.apsusc.2025.165555
M3 - Article
AN - SCOPUS:105024672659
SN - 0169-4332
VL - 722
JO - Applied Surface Science
JF - Applied Surface Science
M1 - 165555
ER -